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From LVDS to eDP: Tianxianwei's TXW133012B0-CTP Brings Modern Interface Architecture to 13.3-Inch Industrial Displays
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From LVDS to eDP: Tianxianwei's TXW133012B0-CTP Brings Modern Interface Architecture to 13.3-Inch Industrial Displays

2026-06-16
Latest company news about From LVDS to eDP: Tianxianwei's TXW133012B0-CTP Brings Modern Interface Architecture to 13.3-Inch Industrial Displays

Tianxianwei Technology Releases TXW133012B0-CTP

13.3-Inch Full-HD Industrial Display Module with Integrated G+G Capacitive Touch

Shenzhen, China — June 16, 2026
Shenzhen Tianxianwei Technology Co., Ltd. today announced the TXW133012B0-CTP. A 13.3-inch active-matrix TFT-LCD module with bonded G+G capacitive touch panel. Built for industrial HMI, medical imaging, and kiosk applications where consumer displays simply do not survive.

Display Core and Optical Performance

The module delivers Full HD resolution with precision pixel architecture:
  • 1920 × 1080 resolution across 293.76 × 165.24 mm active area
  • 0.153 mm pixel pitch with RGB vertical stripe topology
  • Normally Black transmissive mode — suppresses off-state light leakage for outdoor readability
  • ALL O'CLOCK viewing angle — eliminates polarizer-dependent contrast shift at any operator position

Signal Interface Architecture

A 2-lane eDP interface designed for signal integrity in dense enclosures:
  • I-PEX 20455-030E-76 connector with dual differential pairs (Lane0/Lane1)
  • Interleaved H_GND shielding for EMI containment
  • AUX_CH sideband handles EDID handshaking and link training
  • HPD (+2.25V–+3.6V) enables dynamic topology discovery without host polling

Backlight Subsystem

Fifty-four white LEDs in edge-lighting configuration:
  • 700 cd/m² nominal luminance through bonded CTP stack
  • ≥80% uniformity across active area
  • 24.3–30.6V forward voltage at 360 mA typical current
  • 30,000 hours LED lifetime to 50% brightness — critical for remote installations
  • BL_ENABLE and BL_PWM_DIM designated NC — flexible for external driver or GPU AUX dimming

Capacitive Touch Integration

G+G structure eliminates air-gap artifacts:
  • OCA bonded to LCD — no Newton rings, no touch parallax
  • Goodix GT9271 controller over I²C at 2.8–3.3V logic
  • 10-point multi-touch with 6H surface hardness and ≥85% transmittance
  • INT pin for interrupt-driven reporting — reduces bus contention vs. polled I²C
  • Operating: 0°C to +50°C, 20%–90% RH

Mechanical and Thermal Design

Engineered for industrial enclosure integration:
  • LCM: 307.80 × 183.25 × 5.40 mm
  • LCM + CTP: 319.74 × 191.22 × 8.15 mm
  • TP window must exceed LCM active area by 0.3–0.5 mm per edge — thermal expansion accommodation
  • 3M 9495 adhesive (0.175 mm) — NEMA-rated outgassing performance

Electrical Characteristics

TFT logic with isolated power domains:
  • 3.3V nominal (3.0–3.6V range), ripple ≤100 mVp-p
  • PDD1: 0.66W typical / 0.78W max (200 mA / 260 mA)
  • PDD2: 1.27W typical / 1.68W max (385 mA / 560 mA)
  • Galvanic isolation between LCD_GND and BL_GND — prevents LED noise coupling into eDP lanes

Environmental Qualification

Six-item ESS protocol completed:
  • High-temp storage: +60°C / 96H
  • Low-temp storage: -20°C / 96H
  • High-temp operating: +50°C / 96H
  • Low-temp operating: 0°C / 96H
  • προϊόντα
    ΛΕΠΤΟΜΕΡΕΙΕΣ ΕΙΔΗΣΕΩΝ
    From LVDS to eDP: Tianxianwei's TXW133012B0-CTP Brings Modern Interface Architecture to 13.3-Inch Industrial Displays
    2026-06-16
    Latest company news about From LVDS to eDP: Tianxianwei's TXW133012B0-CTP Brings Modern Interface Architecture to 13.3-Inch Industrial Displays

    Tianxianwei Technology Releases TXW133012B0-CTP

    13.3-Inch Full-HD Industrial Display Module with Integrated G+G Capacitive Touch

    Shenzhen, China — June 16, 2026
    Shenzhen Tianxianwei Technology Co., Ltd. today announced the TXW133012B0-CTP. A 13.3-inch active-matrix TFT-LCD module with bonded G+G capacitive touch panel. Built for industrial HMI, medical imaging, and kiosk applications where consumer displays simply do not survive.

    Display Core and Optical Performance

    The module delivers Full HD resolution with precision pixel architecture:
    • 1920 × 1080 resolution across 293.76 × 165.24 mm active area
    • 0.153 mm pixel pitch with RGB vertical stripe topology
    • Normally Black transmissive mode — suppresses off-state light leakage for outdoor readability
    • ALL O'CLOCK viewing angle — eliminates polarizer-dependent contrast shift at any operator position

    Signal Interface Architecture

    A 2-lane eDP interface designed for signal integrity in dense enclosures:
    • I-PEX 20455-030E-76 connector with dual differential pairs (Lane0/Lane1)
    • Interleaved H_GND shielding for EMI containment
    • AUX_CH sideband handles EDID handshaking and link training
    • HPD (+2.25V–+3.6V) enables dynamic topology discovery without host polling

    Backlight Subsystem

    Fifty-four white LEDs in edge-lighting configuration:
    • 700 cd/m² nominal luminance through bonded CTP stack
    • ≥80% uniformity across active area
    • 24.3–30.6V forward voltage at 360 mA typical current
    • 30,000 hours LED lifetime to 50% brightness — critical for remote installations
    • BL_ENABLE and BL_PWM_DIM designated NC — flexible for external driver or GPU AUX dimming

    Capacitive Touch Integration

    G+G structure eliminates air-gap artifacts:
    • OCA bonded to LCD — no Newton rings, no touch parallax
    • Goodix GT9271 controller over I²C at 2.8–3.3V logic
    • 10-point multi-touch with 6H surface hardness and ≥85% transmittance
    • INT pin for interrupt-driven reporting — reduces bus contention vs. polled I²C
    • Operating: 0°C to +50°C, 20%–90% RH

    Mechanical and Thermal Design

    Engineered for industrial enclosure integration:
    • LCM: 307.80 × 183.25 × 5.40 mm
    • LCM + CTP: 319.74 × 191.22 × 8.15 mm
    • TP window must exceed LCM active area by 0.3–0.5 mm per edge — thermal expansion accommodation
    • 3M 9495 adhesive (0.175 mm) — NEMA-rated outgassing performance

    Electrical Characteristics

    TFT logic with isolated power domains:
    • 3.3V nominal (3.0–3.6V range), ripple ≤100 mVp-p
    • PDD1: 0.66W typical / 0.78W max (200 mA / 260 mA)
    • PDD2: 1.27W typical / 1.68W max (385 mA / 560 mA)
    • Galvanic isolation between LCD_GND and BL_GND — prevents LED noise coupling into eDP lanes

    Environmental Qualification

    Six-item ESS protocol completed:
    • High-temp storage: +60°C / 96H
    • Low-temp storage: -20°C / 96H
    • High-temp operating: +50°C / 96H
    • Low-temp operating: 0°C / 96H
    • Sitemap |  Πολιτική απορρήτου | Κίνα Καλή ποιότητα Εικονική οθόνη TFT Προμηθευτής. 2024-2026 Shenzhen Tianxianwei Technology Co., Ltd. Όλα τα δικαιώματα διατηρούνται.